Job Scope:

• Develop and maintain end-to-end cost models for semiconductor products (wafer, die, assembly, and test).
• Analyze yield, process time, and material usage to determine true manufacturing cost.
• Perform cost variance and margin analysis between standard and actual costs.
• Potentially will support new product introductions (NPI) by preparing early cost estimates and validating BOM and process routings.
• Conduct “what-if” simulations to evaluate cost impact of process, yield, or design changes.
• Collaborate with process, yield, and product engineers to identify cost-down and efficiency opportunities.
• Prepare regular cost roll-up reports and dashboards for management.
• Ensure compliance with financial accounting standards (GAAP/IFRS) and internal cost policies.

Requirements:

• Bachelor’s Degree in Engineering (Electrical, Electronics, Industrial, or Manufacturing).
• Minimum 5 years’ experience in product costing or cost engineering within the semiconductor or electronics industry.
• Strong understanding of wafer fabrication, assembly, and test cost drivers.
• Proficiency in ERP systems (SAP / Oracle) and advanced Excel modelling.
• Hands-on experience in analyzing yield, test time, and package cost impact.
• Excellent analytical, problem-solving, and cross-functional communication skills.

Nice To Have :

• Experience in Power BI / Tableau / VBA for data visualization and reporting.
• Familiarity with statistical process control (SPC) and cost optimization projects.
• Knowledge of outsourced assembly and test (OSAT) costing.
• Professional certification (CMA / CPA / CIMA) is an advantage.